Please use this identifier to cite or link to this item: https://olympias.lib.uoi.gr/jspui/handle/123456789/13598
Title: Thermal conductivity and fire resistance of epoxy molding compounds filled with Si3N4 and Al(OH)(3)
Institution and School/Department of submitter: Πανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικών
Keywords: polymer,composites,si3n4,al(oh)(3),thermal conductivity,fire retardation,flame-retardant properties,polymer composites,resins,flammability,combustion,phosphorus,behavior,systems,agent
URI: https://olympias.lib.uoi.gr/jspui/handle/123456789/13598
ISSN: 0261-3069
Link: <Go to ISI>://000298120300110
http://ac.els-cdn.com/S0261306911004900/1-s2.0-S0261306911004900-main.pdf?_tid=94c582789f72407ce71780e2143e6503&acdnat=1339492614_c68293e4826c9192d1db991e246dc455
Publisher: Elsevier
Appears in Collections:Άρθρα σε επιστημονικά περιοδικά ( Ανοικτά)

Files in This Item:
File Description SizeFormat 
Shi-2012-Thermal conductivity.pdf363.19 kBAdobe PDFView/Open    Request a copy


This item is licensed under a Creative Commons License Creative Commons