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https://olympias.lib.uoi.gr/jspui/handle/123456789/14512Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Abadias, G. | en |
| dc.contributor.author | Koutsokeras, L. E. | en |
| dc.contributor.author | Guerin, P. | en |
| dc.contributor.author | Patsalas, P. | en |
| dc.date.accessioned | 2015-11-24T17:38:34Z | - |
| dc.date.available | 2015-11-24T17:38:34Z | - |
| dc.identifier.issn | 0040-6090 | - |
| dc.identifier.uri | https://olympias.lib.uoi.gr/jspui/handle/123456789/14512 | - |
| dc.rights | Default Licence | - |
| dc.subject | stress | en |
| dc.subject | gradients | en |
| dc.subject | in situ | en |
| dc.subject | magnetron sputtering | en |
| dc.subject | ternary nitride | en |
| dc.subject | tin | en |
| dc.subject | zrn | en |
| dc.subject | tan | en |
| dc.subject | deposited thin-films | en |
| dc.subject | preferred orientation | en |
| dc.subject | nitride films | en |
| dc.subject | growth | en |
| dc.subject | coatings | en |
| dc.subject | gradients | en |
| dc.subject | thickness | en |
| dc.subject | systems | en |
| dc.title | Stress evolution in magnetron sputtered Ti-Zr-N and Ti-Ta-N films studied by in situ wafer curvature: Role of energetic particles | en |
| heal.type | journalArticle | - |
| heal.type.en | Journal article | en |
| heal.type.el | Άρθρο Περιοδικού | el |
| heal.identifier.primary | DOI 10.1016/j.tsf.2009.07.183 | - |
| heal.identifier.secondary | <Go to ISI>://000272861500038 | - |
| heal.identifier.secondary | http://ac.els-cdn.com/S0040609009013340/1-s2.0-S0040609009013340-main.pdf?_tid=712e111480b439ebdba4b13d4eaf5e72&acdnat=1339755600_13c13dae600e8a42809a573bf303473f | - |
| heal.language | en | - |
| heal.access | campus | - |
| heal.recordProvider | Πανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικών | el |
| heal.publicationDate | 2009 | - |
| heal.abstract | Stress evolution during reactive magnetron sputtering of binary TiN, ZrN and TaN thin films as well as ternary Ti-Zr-N and Ti-Ta-N solid-solutions was studied using real-time wafer curvature measurements. The energy of the incoming particles (sputtered atoms, backscattered At, ions) was tuned by changing either the metal target (M(Ti) = 47.9, M(Zr) = 91.2 and M(Ta) = 180.9 g/mol), the plasma conditions (effect of pressure, substrate bias or magnetron configuration) for a given target or by combining different metal targets during co-sputtering. Experimental results were discussed using the average energy of the incoming species, as calculated using Monte-Carlo simulations (SRIM code). In the early stage of growth, a rapid evolution to compressive stress states is noticed for all films. A reversal towards tensile stress is observed with increasing thickness at low energetic deposition conditions, revealing the presence of stress gradients. The tensile stress is ascribed to the development of a 'zone T' columnar growth with intercolumnar voids and rough surface. At higher energetic deposition conditions, the atomic peening mechanism is predominant: the stress remains largely compressive and dense films with more globular microstructure and smooth surface are obtained. (C) 2009 Elsevier B.V. All rights reserved. | en |
| heal.publisher | Elsevier | en |
| heal.journalName | Thin Solid Films | en |
| heal.journalType | peer reviewed | - |
| heal.fullTextAvailability | TRUE | - |
| Appears in Collections: | Άρθρα σε επιστημονικά περιοδικά ( Ανοικτά) | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Abadias-2009-Stress evolution in.pdf | 456.52 kB | Adobe PDF | View/Open Request a copy |
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