Please use this identifier to cite or link to this item: https://olympias.lib.uoi.gr/jspui/handle/123456789/14316
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dc.contributor.authorKontziampasis, D.en
dc.contributor.authorBeltsios, K.en
dc.contributor.authorTegou, E.en
dc.contributor.authorArgitis, P.en
dc.contributor.authorGogolides, E.en
dc.date.accessioned2015-11-24T17:37:08Z-
dc.date.available2015-11-24T17:37:08Z-
dc.identifier.issn0021-8995-
dc.identifier.urihttps://olympias.lib.uoi.gr/jspui/handle/123456789/14316-
dc.rightsDefault Licence-
dc.subjectfunctionalization of polymersen
dc.subjectmicrostructureen
dc.subjectphotoresistsen
dc.subjectselectivityen
dc.subjectelectron-beam lithographyen
dc.subjectamplification resistsen
dc.subjectnovolac resisten
dc.titleOptimized Surface Silylation of Chemically Amplified Epoxidized Photoresists for Micromachining Applicationsen
heal.typejournalArticle-
heal.type.enJournal articleen
heal.type.elΆρθρο Περιοδικούel
heal.identifier.primaryDoi 10.1002/App.31644-
heal.identifier.secondary<Go to ISI>://000278886900041-
heal.identifier.secondaryhttp://onlinelibrary.wiley.com/store/10.1002/app.31644/asset/31644_ftp.pdf?v=1&t=h3fkch5l&s=a74231cb3a055288455a98a25c3b2fa57c1b3aff-
heal.languageen-
heal.accesscampus-
heal.recordProviderΠανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικώνel
heal.publicationDate2010-
heal.abstractWe explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. Overall, an attractive positive-tone process is presented as an alternative to the usual negative-tone process for commercial epoxy resists. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 117: 2189-2195, 2010en
heal.publisherWileyen
heal.journalNameJournal of Applied Polymer Scienceen
heal.journalTypepeer reviewed-
heal.fullTextAvailabilityTRUE-
Appears in Collections:Άρθρα σε επιστημονικά περιοδικά ( Ανοικτά)

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