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dc.contributor.authorVlachopoulou, M. E.en
dc.contributor.authorTserepi, A.en
dc.contributor.authorBeltsios, K.en
dc.contributor.authorBoulousis, G.en
dc.contributor.authorGogolides, E.en
dc.date.accessioned2015-11-24T17:36:27Z-
dc.date.available2015-11-24T17:36:27Z-
dc.identifier.issn0167-9317-
dc.identifier.urihttps://olympias.lib.uoi.gr/jspui/handle/123456789/14250-
dc.rightsDefault Licence-
dc.subjectpdmsen
dc.subjectsf6 plasmaen
dc.subjectsurface topographyen
dc.subjectcolumnar structuresen
dc.subjectchain packingen
dc.subjectlithographyen
dc.titleNanostructuring of PDMS surfaces: Dependence on casting solventsen
heal.typejournalArticle-
heal.type.enJournal articleen
heal.type.elΆρθρο Περιοδικούel
heal.identifier.primaryDOI 10.1016/j.mee.2007.01.169-
heal.identifier.secondary<Go to ISI>://000247182500184-
heal.identifier.secondaryhttp://ac.els-cdn.com/S0167931707001943/1-s2.0-S0167931707001943-main.pdf?_tid=31cf7258dc2465aa7aabac9ccf0c9fc8&acdnat=1339662537_8e419bae1248467f996cbf1c1d0131b5-
heal.languageen-
heal.accesscampus-
heal.recordProviderΠανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικώνel
heal.publicationDate2007-
heal.abstractIn this work, the processing properties of poly-dimethylsiloxane (PDMS) are investigated as factors affecting its surface nanostructuring by means of plasma etching. When PDMS films are exposed to SF6 plasmas under conditions ensuring anisotropic etching, column-like structures appear on the PDMS surface. The prime aim of this work is to show that the PDMS surface topography can be tuned by the proper choice of the casting solvent used for the deposition of the PDMS films. In addition, we have prompted the effect of short time chain relaxation of the spun film structure before the introduction of crosslinks through thermal curing. By proper choice of solvent quality and other processing parameters it is found possible to achieve as much as 30% controlled variation of rms roughness and 50% variation of column spacing for a given set of representative plasma conditions. (c) 2007 Elsevier B.V. All rights reserved.en
heal.publisherElsevieren
heal.journalNameMicroelectronic Engineeringen
heal.journalTypepeer reviewed-
heal.fullTextAvailabilityTRUE-
Appears in Collections:Άρθρα σε επιστημονικά περιοδικά ( Ανοικτά)

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