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dc.contributor.authorDendrinos, G.en
dc.contributor.authorQuercia, L.en
dc.contributor.authorRaptis, I.en
dc.contributor.authorManoli, K.en
dc.contributor.authorChatzandroulis, S.en
dc.contributor.authorGoustouridis, D.en
dc.contributor.authorBeltsios, K.en
dc.date.accessioned2015-11-24T17:33:47Z-
dc.date.available2015-11-24T17:33:47Z-
dc.identifier.issn0167-9317-
dc.identifier.urihttps://olympias.lib.uoi.gr/jspui/handle/123456789/13896-
dc.rightsDefault Licence-
dc.subjectpolymer compositesen
dc.subjectchemical sensingen
dc.subjectelectrical sensingen
dc.subjectarraysen
dc.titleElectrical and optical evaluation of polymer composites for chemical sensing applicationsen
heal.typejournalArticle-
heal.type.enJournal articleen
heal.type.elΆρθρο Περιοδικούel
heal.identifier.primaryDOI 10.1016/j.mee.2008.12.001-
heal.identifier.secondary<Go to ISI>://000267273300219-
heal.identifier.secondaryhttp://ac.els-cdn.com/S0167931708006096/1-s2.0-S0167931708006096-main.pdf?_tid=cb3b3938694d7ee97061bc0a65f1ed14&acdnat=1339662513_5773acb43a383ad014ab1ba07a3889e1-
heal.languageen-
heal.accesscampus-
heal.recordProviderΠανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικώνel
heal.publicationDate2009-
heal.abstractIn this work we focus on poly(hydroxy ethyl methacrylate)/carbon black composites for the electrical and optical sensing of humidity and alcohols. The sensitivity is a non-monotonous function of carbon load, while processing with and without ultrasonic agitation can lead to substantially different sensitivity levels. In the case of a carbon-loaded film, optical sensing is limited by the transparency of the carbon-loaded film, which, nevertheless, can be manipulated within limits through the choice of casting solvent. Electrical sensitivity of the composites is compared to the optical (thickness-based) and capacitance sensitivities of the carbon-free poly(hydroxy ethyl methacrylate) version. Composites offer a clear sensitivity advantage when their optimized, on the basis or electrical response, version is employed. (C) 2008 Elsevier B.V. All rights reserved.en
heal.publisherElsevieren
heal.journalNameMicroelectronic Engineeringen
heal.journalTypepeer reviewed-
heal.fullTextAvailabilityTRUE-
Appears in Collections:Άρθρα σε επιστημονικά περιοδικά ( Ανοικτά)

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