Please use this identifier to cite or link to this item: https://olympias.lib.uoi.gr/jspui/handle/123456789/14274
Title: Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites
Institution and School/Department of submitter: Πανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικών
Keywords: composite materials,thermal analysis,encapsulant,underfill,finite element method,polymer composites,ptfe composites,molding compounds,underfill,mixtures,2-phase,solids
URI: https://olympias.lib.uoi.gr/jspui/handle/123456789/14274
ISSN: 1043-7398
Link: <Go to ISI>://000271744500006
Appears in Collections:Άρθρα σε επιστημονικά περιοδικά ( Ανοικτά)

Files in This Item:
There are no files associated with this item.


This item is licensed under a Creative Commons License Creative Commons